LG Electronics says on the 4th that it is jointly developing modular cooling solutions with Flex. The photo shows the logos of LG Electronics and Flex/Courtesy of LG Electronics

LG Electronics said on the 4th that it signed a memorandum of understanding (MOU) with global data center infrastructure company Flex to jointly develop a "modular cooling solution" to solve heat generation in artificial intelligence (AI) data centers.

Flex is a global corporations that provides end-to-end solutions—covering design, development, manufacturing, supply chain management, and after-sales service—across a range of industries, including data centers, autos, healthcare, and telecommunications. Under the agreement, the companies plan to develop a modular data center cooling solution by combining LG Electronics' high-efficiency cooling products—such as chillers, cooling distribution units (CDU), and computer room air handlers (CRAH)—with Flex's IT and power infrastructure.

The solution is designed with a module-based architecture to maximize the scalability and flexibility of data center infrastructure. Built as preassembled and tested cooling modules that are combined on-site with other modules, it has a structure that allows additional cooling modules to be easily scaled as needed. It can also be configured to meet data center thermal management requirements and enables rapid installation.

The two companies said they expect the collaboration to streamline data center build-outs and provide scalable data center infrastructure. LG Electronics is strengthening its data center cooling solutions business with comprehensive cooling technologies that span air cooling and liquid cooling. Recently, it developed a new cooling distribution unit with more than double the previous cooling capacity and added immersion cooling—one of the most power-efficient data center cooling methods—to its portfolio.

Michael Hartung, Flex president and chief commercial officer (CCO), said, "We will provide customers with optimal cooling solutions that solve data center heat challenges through our collaboration with LG Electronics."

Lee Jae-sung, executive vice president and head of the ES Business Unit at LG Electronics, said, "Through our collaboration with Flex, we will deliver innovative, differentiated value while strengthening LG Electronics' position in the AI data center market."

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