HANMI Semiconductor said on the 22nd that it will take part in Semiconductor Exhibition (SEDEX) 2025, held at COEX in Gangnam-gu, Seoul, from the 22nd to the 24th, to unveil next-generation semiconductor equipment.
At this exhibition, HANMI Semiconductor will introduce for the first time at a domestic show the new TC Bonder 4 for HBM4 production, as well as the 2.5D Big-Die TC Bonder and the Big-Die FC Bonder used for AI logic semiconductors.
TC Bonder 4, a key tool for mass production of HBM4, the next-generation high-bandwidth memory, was released in May. Major global memory corporations are planning to begin HBM4 mass production in early 2026, and demand for related equipment is expected to ramp up.
The 2.5D Big-Die TC Bonder and the Big-Die FC Bonder are new tools targeting the AI semiconductor 2.5D packaging market. A key feature is that the 2.5D Big-Die TC Bonder supports large interposer packaging of 120 mm × 120 mm, and the Big-Die FC Bonder supports 75 mm × 75 mm. This can handle a much larger area than the conventional general-purpose semiconductor packaging size of 20 mm × 20 mm, enabling the integration and packaging of ultra-large semiconductors required for AI semiconductors. The Big-Die FC Bonder was released in September, and the 2.5D Big-Die TC Bonder is scheduled for release next year.
HANMI Semiconductor joined the SEDEX exhibition for the first time. Through this, it plans to strengthen its network with domestic integrated device manufacturers (IDM) and outsourced semiconductor assembly and test (OSAT) customers.
A HANMI Semiconductor official said, "Through this SEDEX exhibition, we will introduce the latest bonder equipment to domestic customers and promote our strengthened technological competitiveness."