"If you watch the evolution of the DRAM and foundry (contract chip manufacturing) and packaging processes, you can see that technologies with the same character are being integrated. For semiconductor innovation, the boundaries among memory, logic, and packaging are disappearing, and it is time for them to collaborate and create synergy."
Song Jai-hyuk, Samsung Electronics chief technology officer (CTO) and president, said this on the 22nd at SEDEX 2025, held at COEX in Samseong-dong, Seoul. Song, the 14th chair of the Korea Semiconductor Industry Association, delivered a keynote speech that day on the theme of "Semiconductor innovation through synergy."
Song emphasized that as semiconductor technology becomes more advanced, the boundaries of the technologies applied to products are gradually blurring. He said, "We are in a situation where knowledge is being integrated so we can operate technologies efficiently to generate synergy."
He then explained that because Samsung Electronics has capabilities as an integrated device manufacturer (IDM), it will maximize synergy within its divisions to strengthen its technological prowess. Song said, "There were times I thought it might be a heavy burden that Samsung is the only company in the world that has everything from DRAM and NAND to system semiconductors and packaging," adding, "I think a company with a variety of subjects can create better synergy."
In fact, as the era of artificial intelligence (AI) begins, the boundaries of the technological domains applied to semiconductors are disappearing. With the AI market taking off, demand for high-bandwidth memory (HBM) is surging, and not only the scaling of DRAM but also the importance of packaging technology that stacks and interconnects DRAM and foundry technology for producing the logic die that serves as HBM's brain is coming to the fore.
He particularly assessed that as the technology of scaling semiconductors in planar structures hits its limits, the blurring of boundaries is intensifying. Song said, "Semiconductor technology is advancing beyond planar structures to vertical, bonding, and stacking approaches. The direction is consistent in supplying the performance and unit area that customers want," and added, "DRAM must apply VCT (vertical structure) and bonding (joining) technologies, NAND must evolve through technologies that join chip to chip, and advanced packaging is also needed in various fields, such as hybrid bonding applied to HBM."
He went on to say, "A NAND development employee can move to system semiconductors, and system semiconductor personnel can talk about packaging and generate technical synergy," adding, "To do NAND, DRAM, and system semiconductors, it does not require three teams; knowledge is being combined so efficiently that it can be run with 1.5 teams, or even one team."
Song also explained that the importance of collaboration across disciplines is growing. He said semiconductor collaboration is widening beyond physics to earth science and biology, adding, "I think it is time for Samsung semiconductors to hire experts and get to work."
He added, "Through innovation via collaboration, we can develop technologies to produce high-quality semiconductors that meet customer demand," and said, "We want to develop technology together with companies across various fields—materials, equipment, and test packaging—as well as academia and industry."