As Samsung Electronics and TSMC make large-scale investments in state-of-the-art extreme ultraviolet (EUV) lithography equipment to enter next-generation semiconductor processes at 2-nanometer (nm) and below, they are accelerating pre-ramp work to stabilize mass production in the United States. Both companies appear to be publicly highlighting the import of cutting-edge equipment into their U.S. plants to align with the Trump administration's "Made in USA" stance.
According to the industry on the 21st, TSMC recently took the unusual step of releasing interior footage of its Phoenix Fab 21 plant in Arizona. This is the first time TSMC has released interior footage of an EUV equipment production line it operates in the United States. The industry views it as a response to Intel's recent announcement of commercializing its 18A (2-nanometer class) process and Samsung Electronics' aggressive investment in next-generation EUV equipment.
The interior video of the Phoenix plant released by TSMC shows hundreds of advanced semiconductor manufacturing tools contract-manufacturing chips ordered by U.S. fabless corporations (semiconductor design corporations). This includes Nvidia's latest graphics processing unit (GPU), "Blackwell B300." It also shows the operation of Twinscan NXE EUV lithography equipment from Netherlands-based ASML, used for the most complex chip production.
In the video, TSMC clearly revealed the progress toward producing 3-nanometer-class chips at its U.S. plant. The equipment TSMC is operating in the footage is presumed to be ASML's advanced EUV tool, "Twinscan NXE:3600D," and the fact that it was shown is interpreted as indicating that TSMC is hastening the introduction of cutting-edge processes in the United States.
TSMC's Arizona fab is currently said to be preparing a 4-nanometer-class process, while advanced processes below 3 nanometers would only be possible after 2027, with 2 nanometers expected around 2028. However, the new TSMC video suggests the advanced chip production roadmap at the U.S. plant could be moved up.
This is also seen as a move mindful of the recent "Made in USA" investment stance of Samsung Electronics and Intel. Recently, Samsung Electronics is said to have allocated two High-NA EUV tools to its foundry business unit for ultra-fine processes at 2 nanometers and below, which will shape the company's future. One is slated for the Hwaseong campus, the heart of technology development, and the other is expected to be placed at the Taylor plant in Texas in line with a new large order from a major North American customer.
High-NA EUV tools can implement the finest circuit patterns among existing equipment. With optics 40% improved over conventional EUV tools, they can form circuits 1.7 times more precisely and achieve 2.9 times higher density. Placing such equipment in Taylor, Texas, before it even goes online is seen by industry experts as a move aimed at securing large fabless customers such as Tesla, AMD, Nvidia, and Qualcomm.
A semiconductor industry official said, "Since Vice Chairman Jeon Young-hyun returned as head of the DS (semiconductor) institutional sector, Samsung Electronics, burdened by the size of losses at the foundry business unit, had been running its investment strategy conservatively," and added, "The High-NA EUV investment appears to reflect Samsung Electronics' ambition and confidence to compete again with TSMC, the world's No. 1 foundry corporations, in sub-2-nanometer fine processes."
Meanwhile, Intel also recently said it has begun mass production of its 18A (2-nanometer class) process in Arizona and Oregon. At Fab 52, Intel is mass-producing the new PC and server central processing units (CPUs) "Panther Lake" and "Xeon 6+ (Clearwater Forest)," with initial shipments due by the end of this year. These are the chips with the most advanced process produced in the United States. The U.S. mass production timing for 2-nanometer chips by TSMC and Samsung Electronics is 2026 at the earliest, and there is word that competitor AMD is exploring placing chipset orders with Intel Foundry.