Samsung Electro-Mechanics said that Executive Director Hwang Chi-won (head of the package development team) received a presidential citation at the 20th Electronics and IT Day awards ceremony held on the 21st for contributions to strengthening the competitiveness of Korea's materials and components industry.
The company said the award recognized more than 20 years of leadership in advanced technology development and the enhancement of global competitiveness in the semiconductor package substrate field.
Electronics and IT Day is a commemorative day established in 2005 to mark the surpassing of $100 billion in exports by the electronics and IT industry, and it confers the Order of Industrial Service Merit, the Industrial Service Medal, the presidential citation, the prime minister's citation, and the Minister citation to contributors to the development of the electronics and IT industry and the enhancement of national standing.
Executive Director Hwang Chi-won joined Samsung Electro-Mechanics in 2011 and has led the development of future advanced technologies and manufacturing technologies for package substrates, a core area of semiconductor packaging.
Samsung Electro-Mechanics developed Korea's first high-performance server semiconductor package substrate and began mass production supply to major global customers in 2022.
Hwang secured a new package substrate structure that simultaneously achieves power efficiency and high performance, as well as yield improvement technologies, achieving both technological differentiation and cost and quality competitiveness.
Executive Director Hwang Chi-won said, "Through this award, it is very meaningful that Samsung Electro-Mechanics' development capabilities in semiconductor package substrates have been proven," and added, "We will continue to lead high-performance semiconductor package substrate technologies that will become the core infrastructure of future industries such as AI, cloud, and automotive electronics."
Samsung Electro-Mechanics plans to focus on the high-end semiconductor substrate market, including high-performance servers and networks and autonomous driving, in line with the growth of the cloud market, and to expand the share of high value-added FCBGA products to more than 60% by 2026.