HANMI Semiconductor said on the 22nd that it has launched the "Big-Die FC (Flip Chip) Bonder" and will supply it to global customers. By supplying a mass-production 2.5D advanced packaging bonder, HANMI Semiconductor plans to expand its business scope from high-bandwidth memory (HBM) to artificial intelligence (AI) semiconductors.
The Big-Die FC Bonder supports large interposer packaging measuring 75×75 mm. It can handle a larger area than the conventional general-purpose semiconductor packaging size of 20×20 mm, enabling ultra-large dies and multi-chip integration required in next-generation AI semiconductors.
HANMI Semiconductor emphasized that it will enter the 2.5D advanced packaging market based on the expertise it has built with thermal compression (TC) bonders for high-bandwidth memory (HBM). Starting with this supply, it plans to target major semiconductor foundry companies and outsourced semiconductor assembly and test (OSAT) corporations to expand its customer base.
In the first half of next year, it also signaled the launch of another new piece of equipment, the "2.5D Big-Die TC Bonder."
According to a report by market research firm Yole Intelligence, the semiconductor advanced packaging market is expected to grow at an average annual rate of 9.5%, from $46.0 billion (about 64 trillion won) in 2024 to $79.4 billion (about 110 trillion won) in 2030.