HANMI Semiconductor said on the 18th that it has completed development of artificial intelligence (AI)-based semiconductor equipment technology and plans to apply the technology to all equipment to be released in the future, including the HBM4 production tool "TC Bonder 4."
HANMI Semiconductor last year filed a patent application for FDS (FullSelf Device Setup), an AI-based equipment auto-setting technology. FDS allows the equipment to set itself up without human assistance, enabling the machine to complete in 35 minutes a task that previously took a skilled technician eight hours.
The technology, whose development was recently completed, has been applied to Micro Saw & Vision Placement 6.0 Griffin, a piece of semiconductor equipment produced by HANMI Semiconductor.
HANMI Semiconductor is also preparing to apply the technology to TC Bonder 4, a next-generation HBM4 production tool, and plans to introduce upgraded AI features to all equipment slated for release, including the 2.5D Big-Die TC Bonder and the Big-Die FC Bonder.
In addition, to strengthen competitiveness in AI semiconductor equipment, it established an AI Research Headquarters.
The AI Research Headquarters, composed of about 150 people including existing AI specialists and new hires, will integrate AI technology into semiconductor equipment to drive productivity innovation through process optimization, predictive analytics, and automation.
It will also build an AI assistant to systematically accumulate on-site experience and know-how and to support swift decision-making, expanding the scope of AI application to companywide operations.
A HANMI Semiconductor official said, "We will further strengthen the competitiveness of semiconductor equipment in the global market through the establishment of the AI Research Headquarters," adding, "We will do our best in continuous investment and research and development."