HANMI Semiconductor said on the 10th that it will unveil two new pieces of equipment for artificial intelligence (AI) semiconductors—the "2.5D big-die TC bonder" and the "big-die FC bonder"—at the international semiconductor expo "Semicon Taiwan 2025," which runs in Taipei, Taiwan, through the 12th (local time).
2.5D packaging is an advanced packaging technology that integrates multiple chips—such as a graphics processing unit (GPU), central processing unit (CPU), and high bandwidth memory (HBM)—into a single package on a silicon interposer for consolidation of chips. By enabling expanded bandwidth between chips, faster transmission speeds, and improved power efficiency, it is being actively adopted by global AI semiconductor corporations such as Nvidia and AMD. HANMI Semiconductor plans to make a full-fledged entry into the rapidly growing AI semiconductor 2.5D packaging market with the new equipment.
The two pieces of equipment to be unveiled at Semicon Taiwan support large interposer packaging, unlike conventional general-purpose semiconductors. Customers can choose either a TC bonder or an FC bonder depending on semiconductor characteristics.
HANMI Semiconductor will also introduce for the first time at the expo the "TC bonder 4," new equipment for producing HBM4 (6th-generation high bandwidth memory). It will also promote a range of flagship equipment including the "7th-generation Micro Saw Vision Placement (MSVP) 6.0 Griffin."
A HANMI Semiconductor official said, "By showcasing our 2.5D packaging bonder equipment at this exhibition, we will further strengthen competitiveness in the AI semiconductor market not only for HBM but also for system semiconductors."