SK hynix and Micron are reported to be entering the final testing phase of the 6th generation high bandwidth memory (HBM4) to supply to NVIDIA this month. SK hynix, which is leading the quality tests, is said to be finalizing a contract for the supply of HBM4 for next year with NVIDIA as early as this month. Samsung Electronics is understood to be waging an all-out effort to expedite the testing schedule, which is about two months behind its competitors.
The quality tests for HBM4 planned by SK hynix and Micron this month are at the customer sample (CS) stage, which is the final verification process to ensure that the HBM4 specifications, which will be actually mounted on the AI semiconductor 'Rubin platform' to be released by NVIDIA next year, are optimized. This is essentially the final stage of the quality test following the engineering sample (ES) stage, which checks whether the design and functionality of HBM4 are operating normally.
◇ SK hynix, Micron, and NVIDIA to conduct final tests this month
According to industry sources on the 5th, SK hynix and Micron are planning to submit the final 12-layer HBM4 samples to NVIDIA this month. SK hynix is understood to plan to finalize price and supply schedule adjustments to complete the HBM4 supply negotiations. Although Samsung Electronics is currently about two months behind SK hynix and Micron in the testing schedule, it is reported to be working hard to raise its technical capabilities rapidly to expedite the testing schedule.
Currently, SK hynix is the leading company supplying HBM4 to NVIDIA. It is known that it typically takes over six months from submitting the final sample to complete the product's final certification. However, considering the semiconductor manufacturers' equipment investments and mass production schedules, supply contracts are reported to be conducted ahead of the final certification to ensure timely product delivery. SK hynix exclusively supplied the initial volume of HBM3E (5th generation HBM) 12-layer products to NVIDIA. There are expectations that a significant portion of the HBM4 initial volume will also be supplied by SK hynix.
Son In-jun, a researcher at Heungkuk Securities, noted, "Considering the supply schedule for HBM4, there is a high possibility that the contract for the supply volume of HBM for the first half of next year between SK hynix and NVIDIA will be completed in September," and added, "Given the CS testing schedule, SK hynix appears likely to secure a high initial market share."
◇ Samsung Electronics stabilizes HBM heat issues and yield
Samsung Electronics, which has frequently failed to deliver HBM to NVIDIA, is also lagging behind SK hynix and Micron in the HBM4 testing schedule. Falling behind in the final testing schedule means it will enter supply negotiations the latest, resulting in limitations on delivery volume and reduced bargaining power compared to competitors. For this reason, Samsung Electronics is reported to be putting all effort into accelerating its testing schedule.
Samsung Electronics is said to have expressed confidence that it can gain an advantage over its competitors in terms of HBM4 performance. It applied a 4nm foundry (contract semiconductor manufacturing) process to the 'logic die', which is the brain of HBM4, improving performance and power efficiency. SK hynix is understood to be applying a 12nm process, while Micron is applying a 12nm class DRAM process to the logic die. Samsung Electronics has also applied the most advanced generation of DRAM in the stacking of HBM4. It has been confirmed that the heat issues and yields that had previously been raised as problems in HBM mass production have stabilized significantly.
An insider in the semiconductor industry explained, "Not only has Samsung Electronics applied the 4nm foundry process to the logic die, which is key to HBM, but it has also utilized sixth-generation DRAM chips at the 10nm class (1c, 11-12nm class) for stacking in HBM," and stated, "This is a strategy to gain a performance advantage over SK hynix, which is applying a 12nm process and 10nm class fifth-generation (1b, 11-12nm class) logic die."
He added, "It is true that SK hynix and Micron have entered NVIDIA's supply chain more quickly than Samsung Electronics. However, there is also a view that as we move into HBM4, Samsung Electronics has raised its overall technical capabilities to a level where it can compete on the same level as its competitors."