Samsung Electro-Mechanics and LG Innotek announced on the 3rd that they will participate in the 'International PCB and Semiconductor Packaging Exhibition' (KPCA Show 2025), held at Songdo Convensia in Incheon from the 3rd to the 5th, to showcase next-generation substrate technologies and products.
This year marks the 22nd edition of the exhibition, where over 240 domestic and international companies will participate to share the latest trends in PCB (printed circuit board) and semiconductor packaging technologies.
Samsung Electro-Mechanics will operate booths under two themes: advanced package substrate zone and artificial intelligence (AI) & automotive package substrate zone.
In the advanced package substrate zone, they will showcase core technologies for high-end AI and server-use FCBGA (flip-chip ball grid array), which are currently in mass production. It features an area that is over 10 times larger and an internal layer count greater than three times compared to standard FCBGA.
The glass core package substrate, which is gaining attention as next-generation substrates, reduces the thickness by approximately 40% compared to existing substrates and replaces the plastic core with glass material, making it more resistant to heat and improving signal properties.
Additionally, they will exhibit 2.1D package substrate technology that directly consolidates semiconductors without silicon interposers, co-package substrates that integrate system on chip (SoC) and memory onto a single substrate, FCCSP (flip chip chip scale package) for AI smartphone application processors, high-reliability FC-BGA for automotive use, thin UTC substrates for AI laptops, and embedded substrates with passive components.
LG Innotek has set up a highlight zone at the very front of its exhibition booth to showcase the copper post technology, which has been successfully developed for the first time in the world.
The copper post technology, optimized for semiconductor substrates for smartphones, builds small copper pillars on semiconductor substrates and places solder balls on top to connect the substrate and the mainboard, allowing for more circuits to be placed on the semiconductor substrate. The substrate size can also be reduced by about 20%, and it improves heat dissipation by utilizing copper, which has a thermal conductivity more than seven times higher than that of solder.
Furthermore, they will first unveil a large-area FC-BGA sample sized at 118mm x 115mm for AI and data center uses alongside the main technologies of FC-BGA, such as multi-layer core substrate (MLC) technology and glass substrate technology. The next-generation high-value-added substrate products will inevitably be thicker due to an increased area and more layers than PC products. LG Innotek has designed MLC technology that builds several insulating layers on top and bottom of the core layer into a multi-layer structure, preventing warping and enhancing signal efficiency.
In addition, they will exhibit wireless radio frequency system-in-package (RF-SiP), flip chip chip scale package (FC-CSP) for mobile semiconductor substrates, and chip-on-film (COF), and 2-metal COF for display substrates.