SK hynix announced on the 3rd that it has brought in mass production 'High NA extreme ultraviolet (EUV)' equipment to the Icheon M16 Fab and held a commemorative event.
The High NA EUV equipment is a next-generation photolithography device that applies a larger numerical aperture (NA) than existing EUV, significantly improving resolution and playing a key role in reducing line width and enhancing integration density.
Numerical aperture is a measure of how much light a lens can collect, with a larger value allowing for more precise circuit pattern implementation.
The event held at the Icheon campus was attended by Kim Byung-chan, president of ASML Korea; Cha Sun-yong, vice president of SK hynix (head of the future technology research institute, CTO); and Lee Byung-ki, vice president (in charge of manufacturing technology), who commemorated the introduction of next-generation DRAM production equipment.
SK hynix noted, 'We have laid the foundation to quickly develop and supply advanced products that meet customer demands in the fiercely competitive global semiconductor environment,' and added, 'Through close cooperation with our partners, we will further enhance the reliability and stability of the global semiconductor supply chain.'
For semiconductor manufacturers to enhance productivity and product performance, the advancement of fine process technology is essential. This is because more precise circuit implementation increases chip production per wafer and improves both power efficiency and performance.
Since first introducing EUV to 10-nanometer class 4th generation (1a) DRAM in 2021, the company has continuously expanded the application of EUV to cutting-edge DRAM manufacturing. The recently introduced equipment is the 'TwinScan EXE:5200B' from ASML in the Netherlands, which is the first mass production model of High NA EUV. With improved optical technology (NA 0.55), which is 40% better than existing EUV (NA 0.33), it can achieve 1.7 times more precise circuit formation and 2.9 times higher integration density.
Through the introduction of this equipment, SK hynix plans to simplify existing EUV processes and accelerate next-generation memory development while securing both product performance and cost competitiveness.
Cha, the CTO, stated, 'With the introduction of this equipment, we have secured core infrastructure to realize the future technology vision the company is pursuing,' and added, 'We will lead the AI memory market by developing cutting-edge memory technologies that meet the demands of the rapidly growing AI and next-generation computing markets.'
Meanwhile, Samsung Electronics is reported to have been utilizing High NA equipment since March for the development of memory semiconductors and foundry processes.