The artificial intelligence (AI) semiconductor corporation DeepX announced on the 13th that it has signed a contract with Samsung Foundry for a 2nm manufacturing process for the development of its next-generation generative AI semiconductor 'DX-M2'.
With this contract, DeepX plans to embark on the full-scale semiconductor production of the next-generation product 'DX-M2' for ultra-low-power generative AI on-device inference. Prototype production is expected to begin in the first half of next year, with mass production anticipated in 2027. DeepX noted that the power efficiency (performance-to-power consumption ratio) is about twice improved compared to the 5nm process used in DX-M1.
Starting in November last year, DeepX conducted a detailed analysis of various elements such as power efficiency, performance, manufacturing costs, and yield provided by Samsung Foundry's 2nm process, concluding that it could meet the performance targets required for on-device operation of generative AI.
Two years ago, DeepX developed the product 'DX-M1' specialized for vision AI on Samsung's 5nm process and is currently focusing on yield optimization to improve yields. This product is applied in various industries, including robotics, smart cameras, and factory automation, and is expanding collaborative development for mass production with global clients.
Kim Nok-won, CEO of DeepX, said, "DX-M2 is a key platform that opens the era of popularization and industrialization of generative AI technology," adding, "DeepX will also continue to lower technological barriers and contribute to creating a world where everyone can benefit from AI."