HANMI Semiconductor announced on the 25th that it recorded 180 billion won in consolidated revenue and 86.3 billion won in operating profit for the second quarter of this year.
Revenue increased by 45.8% compared to the same period last year, and operating profit rose by 55.7%. The operating profit margin is 47.9%. The expansion of sales of the core equipment, thermal compression (TC) bonders, drove the performance. TC bonders are essential process equipment for high bandwidth memory (HBM), and HANMI Semiconductor supplies them to SK hynix and Micron.
HANMI Semiconductor also stated that it will invest 100 billion won in hybrid bonding technology and plans to launch hybrid bonder equipment by the end of 2027.
HANMI Semiconductor is investing a total of 100 billion won to build a hybrid bonder factory in the national industrial complex in Juan, Seo-gu, Incheon, aiming for completion in the second half of next year. This facility will have a total floor area of 44,150 pyeong (14570㎡) and be two stories high. With this investment, HANMI Semiconductor will complete a production line with a total area of 27,083 pyeong (89,530㎡).
At this facility, HANMI Semiconductor plans to produce next-generation equipment, including TC bonders for high-spec high bandwidth memory, fluxless bonders, and big die TC bonders for artificial intelligence (AI) 2.5D packages, as well as hybrid bonders used in HBM and logic semiconductor XPU (integrated processing units).