LG Innotek announced on the 25th that it has successfully developed and mass-produced the 'copper post (Cu-Post)' technology, which is applied to high-value semiconductor substrates for mobile use, making it the world's first.
As competition for smartphone slimness intensifies, the demand for technologies that enhance semiconductor substrate performance while minimizing size is increasing.
Anticipating these smartphone trends, LG Innotek has proactively developed the next-generation copper post technology for semiconductor substrates since 2021.
Unlike the traditional method of directly connecting the semiconductor substrate and the motherboard using solder balls, this technology reduces the interval and size of the solder balls by utilizing copper posts.
This allows for miniaturization of the semiconductor substrate and the placement of more circuits on the substrate, thereby effectively achieving smartphone slimness and high performance.
By applying LG Innotek's copper post technology, semiconductor substrates can be produced that are up to 20% smaller in size while delivering the same performance as before.
It is also optimized not only for slimming down smartphone designs but also for handling complex and vast electrical signals efficiently, such as in artificial intelligence (AI) computations and other high-performance functions.
Heat generation can also be improved. The copper used in the copper post has a thermal conductivity more than seven times higher than that of lead, allowing heat generated in semiconductor packages to be dissipated more quickly.
LG Innotek plans to develop its semiconductor parts business, focusing on high-value semiconductor substrates and automotive application processors, to achieve annual sales exceeding 3 trillion won by 2030.
Moon Hyuk-soo, CEO of LG Innotek, said, "This technology stems from a deep consideration not just for the purpose of supplying components but to support our customers' success," adding, "We will change the paradigm of the substrate industry with innovative products and continuously create differential customer value."