LX Semicon announced on the 30th that it has begun mass production of the heat dissipation substrates it has developed as a future growth business.
LX Semicon completed a 3000-pyeong heat dissipation substrate factory in Siheung, Gyeonggi Province, in 2022, investing approximately 100 billion won over the past five years to enhance competitiveness by internalizing the etching process for product mass production. After the factory's completion, it has been producing prototypes to increase its quality control capabilities in order to supply perfect products to customers. Currently, the production capacity of the heat dissipation substrate factory is 250,000 units annually, with plans to expand to 500,000 units by the end of next year.
Eco-friendly heat dissipation substrates for vehicles are characterized by high thermal conductivity to dissipate the heat from power devices and are expected to grow rapidly along with the electric vehicle market. In particular, they are core components that greatly affect the durability and stability of electric vehicle power modules, requiring high reliability that can withstand harsh conditions as well as excellent heat dissipation performance.
LX Semicon's heat dissipation substrates apply the differentiated MDB method. The MDB method is a technology that joins ceramics and copper with a thin and uniform metal layer. Since it can bond the joining surface thinly and uniformly, it ensures high thermal and mechanical reliability. In particular, this method can be utilized not only for high-performance nitride ceramics such as silicon nitride (Si3N4) and aluminum nitride (AIN) but also for economical oxide ceramics such as aluminum oxide (Al2O3). Therefore, it can be applied to various industrial fields, including eco-friendly automobiles, electric vehicle chargers, energy storage devices, and high-speed trains.
CEO Yoon-tae Lee of LX Semicon said, "We will provide the best satisfaction to customers through differentiated manufacturing technology and strict quality control," and noted, "In the future, we will diversify the portfolio of heat dissipation substrate products to expand our customer base."