Hanwha Semitech announced on the 27th that it has signed a contract to supply high bandwidth memory (HBM) TC bonders to SK hynix. The delivery scale is 21 billion won.
Hanwha Semitech signed its second contract today, following the first supply contract for HBM TC bonders worth 21 billion won with SK hynix on the 14th.
TC bonders are essential equipment used to manufacture HBM for artificial intelligence (AI) semiconductors. HBM is made by stacking multiple DRAM chips, and TC bonders are used in the process to secure them with heat and pressure.
Since last year, Hanwha Semitech has been collaborating with SK hynix and has been dedicated to technology development. On the 10th of last month, it changed its name from Hanwha Precision Machinery to Hanwha Semitech to express its intention to become a 'comprehensive semiconductor manufacturing solutions corporation.' At the same time, Vice President Kim Dong-seon, the third son of Hanwha Group Chairman Kim Seung-yeon, joined the company as the head of future vision.
Vice President Kim noted at the 'Semicon Korea 2025', the largest semiconductor fair in the country, that 'the key to market competitiveness is solely innovation technology,' stating that 'we will continuously expand investment in research and development to differentiate our technology.' Hanwha Semitech reported that Vice President Kim has been actively supporting by directly participating in client meetings and emphasizing the quality and technological capabilities of products since his appointment.
A representative from Hanwha Semitech said regarding this contract that 'we were able to secure additional orders following our initial market entry this month,' adding that 'this further acknowledges our technological capability and product quality, and we will continue to expand our market presence.'