On the 24th, semiconductor design house GAONCHIPS announced it would strengthen strategic cooperation in the IP field by signing a cooperation program contract with Cadence for semiconductor design assets (IPA).
Through this contract, GAONCHIPS plans to secure access to Cadence's latest memory IP and enhance its capabilities in next-generation artificial intelligence (AI) high-performance computing (HPC) and automotive semiconductor design through proactive analysis and technology internalization.
GAONCHIPS stated that utilizing the latest IP and design analysis capabilities is essential for the development of advanced semiconductors, and investment in these areas acts as a core element of corporate competitiveness.
GAONCHIPS has secured a project for an advanced process of 2 NANO (nanometer, one billionth of a meter) HPC from a foreign client. The company is currently focusing on penetrating the Japanese and North American markets and plans to also concentrate on developing major overseas markets such as Europe in the future.
Seobyeonghun, the representative of Cadence Korea, noted, "I expect this IPA partnership will provide GAONCHIPS and fabless clients with more opportunities to effectively utilize Cadence's latest IP," adding that the company plans to actively support GAONCHIPS' customer project success.
Jeongguydong, the representative of GAONCHIPS, said, "Based on close cooperation between GAONCHIPS and Cadence, we will spare no effort in comprehensive cooperation to enable our clients to develop competitive system-on-chip (SoC) products more quickly."