DeepX, an artificial intelligence (AI) semiconductor startup, announced on the 25th that it will demonstrate an on-device AI solution utilizing a first-generation AI chip in collaboration with LG Uplus at the world's largest mobile exhibition, Mobile World Congress (MWC) 2025, which opens in Barcelona, Spain, on the 3rd of next month.
Additionally, DeepX plans to operate an independent booth to unveil the roadmap for its on-device AI semiconductor DX-M2 designed for large language models (LLM).
Since the beginning of this year, DeepX has been showcasing its AI semiconductor solutions, starting with the Consumer Electronics Show (CES) 2025 held last month in Las Vegas, United States. At CES 2025, DeepX presented various application examples from global corporations related to edge devices, such as smart cities, smart factories, and robots, equipped with mass-produced products, as well as industrial equipment and edge servers.
Alongside this, DeepX demonstrated AI algorithms for robots from Hyundai Motor Robotics Lab, industrial AI algorithms from InvenTech in Taiwan, AI algorithms for factory automation and logistics automation from POSCO DX, and AI algorithms based on vision-language models for industrial sites and urban safety from LG Uplus on its mass-produced products.
From the 11th of next month, at Embedded World taking place in Nuremberg, Germany, DeepX plans to exhibit solutions equipped with its products at the booths of global partners such as Micron, Raspberry Pi, Aon, DFI, Portwell, SEEED, BIOSTAR, Advantech, and Network Optics, while also operating an independent booth to conduct business consultations with potential customers.
Furthermore, DeepX aims to expand its application scope into various fields requiring advanced AI technologies by participating in ISC West, a physical security industry exhibition held in Las Vegas, United States, in April, and Computex Taipei in Taiwan in May, showcasing mass production chip application cases extensively at both its own booth and partner booths.