Advanced packaging technologies and high-bandwidth memory (HBM) have significantly increased semiconductor demand, but there is intense behind-the-scenes competition among global semiconductor and component corporations preparing for the next generation. This is because advanced packaging technologies such as HBM and "chip on wafer on substrate (CoWoS)" have begun to see technological growth stagnate due to heat generation, power consumption, and expense issues. Accordingly, corporations preparing for the post-semiconductor paradigm dominated by the NVIDIA-TSMC duo are accelerating their next-generation technology development.
According to the industry on the 20th, domestic corporations including Samsung Electronics and Samsung Electro-Mechanics, along with SKC and LG Innotek, are developing glass substrate technologies, while equipment corporations such as Philoptics and EO Technics are also entering the glass substrate business. Overseas, companies like Intel, AMD, and Broadcom have established roadmaps for the glass substrate business and have begun development and mass production efforts.
Currently, the global semiconductor market is dominated by NVIDIA, a fabless semiconductor design company, and TSMC, a foundry company, which have established a monopoly system in line with the artificial intelligence (AI) trend. However, the supply shortage compared to demand is not being resolved, leading to a deepening AI semiconductor "bubble" and revealing technological limitations. The emergence of HBM and CoWoS has briefly surpassed "Moore's Law," but after HBM3E (fifth-generation HBM), it has become difficult to control heat generation and power consumption, raising concerns about investment efficiency.
This is also why glass substrates have begun to gain attention. Glass substrates are made from thin and hard glass material instead of existing silicon or organic substrates. Compared to existing substrates, they have a lower thermal expansion rate, almost eliminating warpage at high temperatures, and they can transmit up to 10 times more electrical signals in the same area. Power consumption can also be significantly reduced compared to existing semiconductor substrates. Glass substrates can resolve issues arising as semiconductor chips continue to shrink and performance becomes stronger.
Kim Jong-min, a senior researcher at Samsung Securities, noted, "If new technological innovations centered on glass substrates are possible, there could be an 'underdog rebellion' that overturns the NVIDIA-TSMC monopoly system," adding that there are past cases where underdogs who captured new hegemony with innovations in smartphones, graphic processing units (GPUs), and HBM reversed the leading companies.
Contrary to initial industry forecasts that it would take more than 10 years, technology development is progressing rapidly. In the case of AMD, it aims to apply glass substrates to advanced semiconductors by 2028, replacing silicon interposers. It plans to begin prototype production as early as next year. Broadcom is already conducting performance evaluations to introduce glass substrates into its semiconductor chips. Intel has invested $1 billion in glass substrate development and aims for mass production by 2030.
Domestic corporations have also thrown down the gauntlet, with various organizations including large semiconductor companies, material and component manufacturers, and equipment manufacturers stepping up. Samsung Electronics plans to enter the glass substrate market by establishing its own supply chain, while SKC aims to produce glass substrates directly through its subsidiary, ApSolix. LG Innotek has also set a production roadmap in collaboration with major materials and parts corporations, and Samsung Electronics has decided to begin direct production after completing the setup of glass substrate production equipment.
Additionally, Philoptics is manufacturing TGV, ABF film attachment, and singulation equipment, while GigaVis is conducting business in ultra-fine inspection equipment. EO Technics is already supplying UV drillers for glass substrates, and HB Technology is stepping into the glass substrate equipment business based on post-process repair equipment.
A semiconductor industry official said, "As research and development is progressing across semiconductor design and production companies, as well as materials and equipment, the timeline for glass substrate production is accelerating," adding that "if the application of glass substrates in memory and other areas begins with Intel and AMD, innovations will occur in many fields, including existing semiconductor packaging and fine processing."