Qualcomm and Hyundai Mobis are collaborating to develop next-generation high performance computer (HPC) platform technology for innovations in vehicular infotainment and advanced driver assistance systems (ADAS).
At the Consumer Electronics Show (CES) 2025, which opens on Jan. 7 in Las Vegas, Qualcomm will showcase a high-performance infotainment system and advanced driver assistance system (ADAS) solutions that combine Qualcomm's Snapdragon Ride Flex system on chip (SoC) and Snapdragon Ride automated driving stack with Hyundai Mobis' advanced software and sensors.
The Snapdragon Ride Flex SoC supports cockpit, ADAS, and automated driving (AD) from a single chipset, and its high-performance processing capabilities and software framework are designed to provide enhanced performance, safety, and efficiency to global automakers by integrating with Hyundai Mobis' state-of-the-art software applications.
As the functions and software applied to vehicles in the current era become increasingly complex, a central computer for efficiently managing various functions has become an essential element. The Snapdragon Ride Flex SoC is designed to meet these demands, capable of handling flexible and differently prioritized workloads.
Additionally, the solution creates an environment for interference-free functionality, supporting both safety-critical application functions and general application functions from a single chipset, providing scalability from entry-level models to premium tiers. This system supports advanced cockpit features equipped with integrated dashboards, driving and parking solutions, and ADAS systems based on the Snapdragon Ride automated driving stack, combined with Hyundai Mobis' extensive software and solutions.
Jung Su-kyung, vice president of Hyundai Mobis, said, "By integrating Hyundai Mobis' key technologies, including electronics, chassis, and electrification, with Qualcomm's system solutions, we can present a direction and standards for vehicle central computer development and ultimately meet consumer expectations."
Kwon Oh-hyung, senior vice president of Qualcomm headquarters and head of the Asia-Pacific region, noted, "Qualcomm is enhancing the accessibility and cost efficiency of software-defined vehicle (SDV) technology for automakers through the Snapdragon Ride Flex SoC, supporting their transition to an integrated, open, and scalable architecture across all vehicle domains. We look forward to Qualcomm's Ride Flex solution being adopted in vehicles from global original equipment manufacturers (OEMs) to be launched in the future, in partnership with Hyundai Mobis."