SK hynix announced on the 3rd that it will present its blueprint as a 'full stack artificial intelligence (AI) memory provider' at the 'CES 2025' to be held in Las Vegas, USA, from the 7th to the 10th (local time).
The event will be attended by Kwon No-jung, CEO and president of SK hynix, along with Kim Joo-seon, president (CMO) of AI Infrastructure, and Ahn Hyun, president (CDO) of Development. Kim Joo-seon noted, "At this CES, we will broadly showcase representative AI memory products, including high bandwidth memory (HBM) and eSSD, as well as solutions optimized for on-device AI and next-generation AI memory." He emphasized, "Through this, we aim to widely communicate our technological competitiveness in preparing for the future as a 'full stack AI memory provider.'"
SK hynix will operate a joint exhibition hall with SK affiliates, including SK Telecom, SKC, and SK Enmove, under the theme 'Creating a sustainable future with innovative AI technology.' The exhibition hall is designed in the form of waves of light to showcase how the AI infrastructure and services owned by the SK Group are transforming the world.
At this exhibition, SK hynix will showcase samples of its 5th generation HBM, specifically the HBM3E 16-layer product. This product, which implements the industry's highest tier of 16 layers using advanced MR-MUF processes, also controls chip warping and maximizes heat dissipation performance. SK hynix, which has begun mass production of the world's first HBM3E 12-layer product, plans to supply samples of the HBM3E 16-layer product in the first half of this year following the official announcement of its development in November last year.
Additionally, SK hynix will display high-capacity and high-performance enterprise SSD products, which have seen a surge in demand as AI data center construction increases. This includes the 122TB (terabytes) D5-P5336 product developed by its subsidiary Solidime in November last year. This product boasts the largest existing capacity with high power and space efficiency. Ahn Hyun stated, "Following Solidime, SK hynix has also successfully developed a QLC-based 61TB product last December, and we expect to maximize synergies based on a balanced portfolio between the two companies in the high-capacity eSSD market."
SK hynix will also showcase products for on-device AI, such as LPCAMM2 and ZUFS 4.0, which improve processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. It will also display the Compute Express Link (CXL) and intelligent semiconductor (PIM), which will become core infrastructures in the next-generation data center, and the modularized CMM (CXL Memory Module)-Ax and AiMX that apply these technologies. Notably, SK hynix described CMM-Ax as a groundbreaking product that can enhance performance and energy efficiency of next-generation server platforms by adding computational capabilities to the advantages of CXL for expanding high-capacity memory.
CEO Kwon No-jung said, "We will lead the customized HBM market that meets the diverse needs of customers by mass-producing 6th generation HBM (HBM4) in the second half of this year," adding, "We will continue to do our best to present new possibilities in the AI era and provide customers with irreplaceable value based on technological innovation."