Advanced materials corporations JNTC(204270) will move to commercialize next-generation semiconductor through-glass via (TGV) glass substrates with Japanese semiconductor packaging company TOPPAN.
JNTC said on the 13th that it signed an agreement with TOPPAN on the 7th to commercialize TGV glass substrates. The two companies will jointly review product performance and mass production applicability for the TGV glass substrates developed by JNTC and push ahead with commercialization cooperation.
The cooperation comes as JNTC accelerates expansion of its TGV glass substrate business while building a global supply chain. JNTC said last month it succeeded in developing high-difficulty TGV glass substrates applicable to glass thicknesses from 0.3 mm to 2.0 mm.
In particular, the recently developed 2.0 mm-thick product does not use the industry's commonly reviewed method of bonding two 1.0 mm glass sheets, but instead uses a single 2.0 mm monolithic glass master. It is a high-difficulty product applied to next-generation packaging for AI Semiconductor, and the company said it has secured a Production yield of up to 94% for mass production.
JNTC said it has secured key technologies for preventing micro-cracks, removing voids, and minimizing warpage—considered core tasks for commercializing TGV glass substrates—and is receiving positive evaluations from global customers on productivity and price competitiveness.
JNTC mainly produces mobile cover glass, automotive tempered glass, and smartphone connectors, and entered the semiconductor glass substrate business in 2024. About two years later, it established a TGV glass substrate production process and expanded the business to the stage of cooperating with global corporations for commercialization. The company said, "We have internalized equipment manufacturing technology accumulated over 40 years, more than 30 years of plating technology, and laser, etching, and cutting technologies secured through over 20 years in the tempered glass business to secure competitiveness in developing TGV glass substrates."
Chief Executive Cho Nam-hyeok of JNTC said, "We are conducting various projects and product evaluations with global top-tier semiconductor corporations and semiconductor packaging companies in greater China, Japan, Europe, and Korea, aiming for mass production in 2027," adding, "To respond quickly to customized demand from global customers, we plan to push for a strategic expansion of mass production lines in Korea going forward."