Lotte Energy Materials said on the 22nd that it signed a memorandum of understanding (MOU) with Doosan Electronics BG to cooperate on development evaluation and supply of copper foil used in high-performance printed circuit boards (PCBs) for artificial intelligence (AI) data centers and network equipment.
As core material suppliers to advanced industries such as AI Semiconductor and fifth-generation mobile communications (5G), Lotte Energy Materials holds ultra-low-profile (HVLP) grade 4 circuit foil technology, and Doosan Electronics BG holds world-class copper-clad laminate (CCL) technology.
Through this MOU, the two companies plan to collaborate on developing and supplying materials that reduce signal loss and enhance reliability to meet demand for higher speeds and higher layer counts in AI and network equipment. They also expected effects such as reducing dependence on imports of certain items, stabilizing supply chains, and securing technology.
Chief Executive Kim Yeon-seop of Lotte Energy Materials said, "Ultra-low-profile copper foil and low-loss CCL are key materials in the AI network era," adding, "We will work to advance a stable supply system and strengthen global competitiveness through collaboration with Doosan Electronics."