DN Solutions, a machine tool corporation, said on the 4th that it has released a series of high-precision grinding machines needed for the semiconductor industry.
The machines are for making consumable parts such as focus rings used in semiconductor wafer processes, and were named the DNC (DN Solutions Ceramic) series to reflect DN Solutions' ceramic machining capability.
The DNC series applies a grinding spindle technology that delivers speeds of up to 10,000 rpm and 7.5 kW of output. It also reduces vibration with a monolithic high-rigidity bed and feed-axis guides to prevent quality degradation during long machining.
In addition, unlike existing equipment whose grinding spindle position easily goes out of alignment, structural rigidity was increased to maintain precision over a long lifespan, and a cover structure was applied to prevent dust or cutting fluid from entering the equipment.
Thanks to this, the DNC series can precisely machine difficult materials such as quartz, ceramics, and silicon carbide, enabling the production of wafer consumables with high durability against high temperatures and chemicals.
A DN Solutions official said, "DN Solutions already holds half of Korea's semiconductor material machining equipment market share, and nearly 80% in some processes," adding, "The DNC series is a product developed based on long-standing know-how and on-site experience."