HANMI Semiconductor announced on the 17th that Chairman Kwon Dong-shin will undertake a 3 billion won share buyback. This is the second this year, following last month. The planned acquisition date is April 15. Once the acquisition is completed, Chairman Kwon will have bought back shares worth a total of 42.3 billion won since 2023, raising his equity stake from 33.97% to 34%.
HANMI Semiconductor is a leader in the global high bandwidth memory (HBM) manufacturing institutional sector, specifically in the 'TC Bonder' segment. Chairman Kwon's decision to buy back shares reflects confidence in the technology and future growth of HANMI Semiconductor's TC Bonder in the HBM equipment market.
Chairman Kwon said, "HANMI Semiconductor's TC Bonder has the world's top competitiveness," and added, "I believe there is a significant technological gap between us and the latecomers such as ASMPT and Hanwha Semiconductor."
Chairman Kwon also noted, "As the AI semiconductor market led by NVIDIA grows, the demand for TC Bonder equipment for HBM is explosively increasing this year as well," and added, "With over 45 years of experience and more than 120 HBM equipment patents, HANMI Semiconductor, which has global customers such as SK hynix and Micron Technology, is set to smoothly ship more than 300 TC Bonders in 2025."