Korea Semiconductor President Kwak Dong-shin noted on the 8th that he attended the groundbreaking ceremony for Micron Technology's new high-bandwidth memory (HBM) packaging plant in Singapore.

The newly constructed Micron plant will produce high-performance HBM applied to NVIDIA and Broadcom, centers of AI semiconductor growth, and is expected to be completed around 2027.

Kwak Dong-shin, chairman of Hanmi Semiconductor (in the center), attends the groundbreaking ceremony for the new Myron HBM packaging plant with executives on the morning of Nov. 8 in Woodlands, Singapore. /Courtesy of Hanmi Semiconductor

Currently, Micron is producing HBM at its factory in Taiwan. In the future, the company plans to operate HBM production facilities at the newly constructed Singapore HBM-exclusive plant, as well as in Idaho, USA in 2026, and in New York, USA, and Hiroshima, Japan in 2027.

Sanjai Mehrotra, Micron's president, mentioned during last year's third-quarter earnings conference call that they aim to increase their HBM market share to the 20% range by 2025. This is more than double the target of approximately 9% in 2024. According to the market research firm TrendForce, Micron's HBM production capacity was about 20,000 units per month at the end of last year, and it is expected to expand to 60,000 units per month by the end of 2025.

Korea Semiconductor, holding the world's largest market share in TC bonders, began supplying to Micron in April 2024, following SK Hynix. The company expects that its TC bonder sales will increase in line with the expansion of Micron's HBM production capacity.