Lotte Energy Materials announced on the 17th that it will supply the industry's first next-generation artificial intelligence (AI) accelerator-oriented HVLP (Hyper Very Low Profile) grade 4 copper foil.
The corporation will supply AI accelerator-oriented HVLP grade 4 ultra-low copper foil to Doosan Electronics BG, a global manufacturer of copper-clad laminates (CCL), starting this month.
The corporation established a system capable of producing 1,800 tons (t) of next-generation HVLP grade 4 ultra-low copper foil for AI accelerators at its Iksan Plant No. 1 in Jeollabuk-do last month. It converted the existing universal circuit board line into a high-value-added HVLP grade 4 line and has begun full-scale production.
HVLP copper foil is classified into 1st to 3rd generations according to high-speed signal transmission efficiency, with the products currently used in AI accelerators being 3rd generation or lower models. The HVLP grade 4 ultra-low copper foil being supplied this time has lower brightness (surface roughness) than the 3rd generation, minimizing signal loss, and is a 4th generation product with superior adhesion strength due to the application of nano surface treatment technology.
Lotte Energy Materials' Iksan Plant No. 1 plans to reorganize its production system to focus on high-value-added products, starting with the supply of HVLP grade 4 ultra-low copper foil, including network-oriented and semiconductor packaging copper foils, as well as high-end battery foils.
Kim Yeon-seop, CEO of Lotte Energy Materials, said, “With this supply, we will solidify the value chain for network-oriented products such as AI accelerators and position ourselves as a key supplier contributing to the growth of our clients.”