Hanmi Semiconductor jumps 15% early on the 27th. The rally is seen as driven by word that it launched the world's first "BOC COB bonder" and will supply it to a U.S. global memory customer.
As of 9:30 a.m. that day on the Korea Exchange, HANMI Semiconductor was trading at 315,500 won, up 40,000 won (14.52%) from the previous session. It traded at 327,000 won during the session, setting a new 1-year high.
That day, HANMI Semiconductor said it launched a "Two-in-One bonding system" that can perform both the "board on chip (BOC)" process and the "chip on board (COB)" process on a single machine. According to the company, the system is the world's first bonder integrating the two processes.
The company also said the new BOC COB bonder is slated to be deployed at a global customer's plant in Gujarat, India. In the industry, with the U.S. semiconductor company Micron building a memory plant in Gujarat, India and reportedly set to start operations soon, the possibility that Micron is the buyer has been raised, which is seen as buoying investor sentiment.