On the 14th morning, shares of semiconductor equipment maker HANMI Semiconductor rose more than 4%. The gain is seen as driven by news of an order contract for a thermo-compression (TC) bonder with SK hynix a day ahead of its earnings announcement.
As of 9:14 a.m. that day, HANMI Semiconductor was trading at 180,800 won, up 7,600 won (4.39%) from the previous session on the Korea Exchange.
Earlier, HANMI Semiconductor disclosed that it signed a contract with SK hynix to supply TC bonder equipment for high bandwidth memory (HBM) worth 9.65 billion won. The company plans to complete delivery of the equipment by Apr. 1.
The TC bonder is equipment that can be applied not only to HBM3E (5th generation), the current market mainstream, but also to production of HBM4 (6th generation), which is expected to enter full commercial use starting late this year.