HANMI Semiconductor surged at the beginning of trading on the 26th, breaking through the 100,000 won mark. This is interpreted as being influenced by the news that HANMI Semiconductor will supply next-generation high-bandwidth memory (HBM) manufacturing equipment.
As of 9:26 a.m. on the same day, HANMI Semiconductor was trading at 10,610 won, up 8,600 won (8.82%) from the previous trading day.
HANMI Semiconductor has been on a continuous upward trend since reports emerged last year that it delivered TC bonders to a Chinese semiconductor corporation. TC bonders are known to be essential for the HBM manufacturing process as they are used to attach or stack semiconductor chips onto wafers.
However, uncertainty remains due to the semiconductor sanctions the United States has imposed on China. Although TC bonders are not included in the list of banned export items, there are concerns that if China shows progress in the HBM business, it could face future pressure from the United States.