Specialized advanced composite material company ICH indicated on the 11th that it will accelerate the commercialization of high-performance heat control materials.
ICH is nurturing heat control materials as a future growth sector. This is because it is increasingly important to resolve heat generation issues as artificial intelligence (AI) semiconductors are being installed on devices, along with the integration of semiconductor miniaturization.
ICH is currently preparing to commercialize special insulation materials for AI semiconductors. ICH plans to add a new material with low thermal conductivity to its manufacturing technology, which it secured through the production of polyurethane (PU) foam. The company also decided to enhance price competitiveness by utilizing existing production facilities.
ICH is also working to commercialize new materials to replace the metal mesh in vapor chambers used for heat dissipation of application processors (AP) in smartphones. This new material has thermal dispersion capabilities comparable to metal mesh while reducing the thickness to half of the existing size, at less than 30 microns (㎛), through coating or surface treatment of fabric substrates. ICH believes that using fabric instead of costly metal wire will present a cost advantage.
An ICH official noted, “We will develop high-performance new materials, enhance price competitiveness through internalization of core processes, and rapidly replace existing materials.” He added, “We will also prepare for the development and commercialization of new materials related to industries where thermal management is becoming important, such as power semiconductors, displays, and secondary batteries.”